晶圆重入加工的组合设备终止暂态的调度与分析

Scheduling and analysis of final transient process for cluster tools with wafer revisiting

中文关键词  晶圆制造  组合设备  重入加工  Petri网  建模  调度  仿真

英文关键词  wafer fabrication  cluster tools  revisiting  Petri net  modeling  scheduling  simulation

中文摘要

      晶圆重入是半导体组合设备加工中典型的复杂加工工艺, 分析和优化暂态加工过程对于晶圆重入加工具 有重要意义. 为了满足加工需求和提高组合设备的加工性能, 基于稳态重入加工的双臂组合设备Petri网模型和1-晶 圆周期调度策略, 采用虚拟晶圆的加工模式分析了系统的终止暂态过程, 讨论了系统终止暂态的加工时间分布, 并 给出相应的解析式进行描述. 利用eM-Plant仿真平台建立了重入加工的双臂组合设备终止暂态的仿真模型, 并用例 子验证了1-晶圆周期调度的可行性及解析式的有效性, 为研究晶圆重入加工过程的优化提供了有效方法和手段.

英文摘要

      For some semiconductor fabrication processes in cluster tools, wafer revisiting is a typical and complicate process. Analysis and optimization of the transient process is of great significance for wafer processing. Based on the Petri net and 1-wafer cyclic schedule, in order to meet processing requirements and improve processing performance of cluster tools, the final transient process for dual-arm cluster tools with wafer revisiting is analyzed by using virtual wafer processing mode. Then, the processing time of final transient process in different conditions is described by some expressions. For final transient process with wafer revisiting to be analyzed more intuitively, a simulation model is developed by using eMPlant as a simulation platform. With this model, illustrative examples are given to show the feasibility of 1-wafer cyclic schedule and effectiveness of the expressions. Thus, the simulation model provides an effective tool for researchers to study the optimization of wafer fabrication with revisiting.